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- process library
- endpoint detection
- data logging
The Takachi provides etching capabilities over a variety of materials and substrates. The small footprint, low cost, ease of use and superior performance make the Takachi Series ideal for a wide range of uniform, high quality ICP etch applications serving R&D, FA, prototyping, pilot line and low volume production. The Takachi Series is ideal for numerous technologies such as Failure/Yield Analysis, Photonics, Solid State Lighting, MEMs, and Wireless ICP etch processing.
Corial 200 SERIES
- failure analysis
he Corial 200 Series is a flexible and scalable platform for etch and deposition applications. The platform can accommodate a whole host of substrate sizes and handling configurations, plasma processing technologies, and process chemistry configurations.
This platform is ideally suited for R&D and low volume production, handling up to 200 mm wafer sizes.
The process recipes developed for the Corial 200 Series provide etch and deposition solutions for a broad range of markets, including failure analysis, microelectromechanical systems (MEMS), optoelectronics, advanced packaging, wireless devices, and power semiconductors.
Versaline etching & deposition
- casette and clusters
- loadlock for single substrate or single batch carrier
VERSALINE system models are configured to perform an array of etch and deposition processes. Ion beam technology suits a range of applications, from low, controllable damage etching to high-rate, high-aspect-ratio, deep silicon etching to difficult materials. The systems support process control through EndpointWorks®. Enhancements include data logging, automated maintenance scheduler (AMS), and SECS/GEM. Our Cortex® control system provides a stable, user-friendly control interface designed for efficiency and productivity.
The VERSALINE platform’s modular design allows for flexible configuration of substrate handling for a variety of handling options, from R&D single wafer or carrier loading with a loadlock to high-volume, multi-chamber production clusters. Clear upgrade paths that leverage costs and process development make future planning easy.
Eclipse PVD System
- industry first choice
- small footprint
- high troughput
The Eclipse Mark IV physical vapor deposition (PVD) system is an upgrade from the Mark II, offering a larger process portfolio and occupying a smaller footprint. The Mark IV is used for depositing metal for interconnects, via fill, silicides, packaging (C4, die attach), and other processes. The wafer transport is suitable for gallium arsenide, other compound semiconductor wafers, and thinned silicon wafers. Sputtering occurs in vacuum-isolated chambers, limiting contamination. The system features the upgraded Epoch controller with enhanced throughput and factory automation support.
- advanced packaging
- dual-channel showerhead
- auto logging
When thick and conformal films matter, fast atomic sequential technology (F.A.S.T.) is the solution. Based on Plasma-Therm’s® proprietary chemical vapor deposition (CVD) reactor design combined with pulsed capability, F.A.S.T. offers new solutions for 3D integration challenges and other aggressive aspect ratio applications.
F.A.S.T. delivers film conformality superior to plasma-enhanced CVD (PECVD) at deposition rates greater than that of atomic layer deposition (ALD).
Quazar etching & deposition
- ion beam etch
- ion beam deposition
The quazar systems incorporate high-performance large-area ion sources and advanced motion control for industry-leading process results for challenging etching applications and advanced thin film material applications.
The QuaZar systems, whether configured for R&D or production, delivers best-in-class uniformity and throughput and the lowest cost of ownership. QuaZar’s Marathon grids™ technology is the key enabler of this verified performance. Marathon grids can be installed on existing systems to improve performance and gain two times longer life or better.
Official partner of Plasma-Therm
Plasma-Therm is a global manufacturer of advanced plasma-processing equipment, providing etch, deposition, and plasma dicing technologies used in semiconductor packaging, solid-state lighting, power, data storage, renewable energy, MEMS, nanotechnology, photonics, and wireless communication markets. Plasma-Therm’s VERSALINE platform is the workhorse for a variety of applications in specialty semiconductor markets. The platform's modular design allows flexible configuration of substrate handling and technologies that address the wide range of customer requirements. Plasma-Therm’s Singulator® systems bring the precision and speed of plasma dicing to chip-packaging applications. Manufacturers, academic and governmental institutions depend on Plasma-Therm equipment, designed with “lab-to-fab” flexibility to meet the requirements of both R&D and volume production. Plasma-Therm's products have been adopted globally and have earned their reputation for value, reliability, and world-class support. Named the #1 Etch Equipment Supplier in 2019, Plasma-Therm has more than two decades of awards in the VLSIresearch Customer Satisfaction Survey, including the highest score ever earned by a semiconductor equipment company.