Quantum Dot‑Powered SWIR Imaging

Quantum Dot SWIR Imaging for Semiconductor Inspection

As semiconductor devices shrink and materials become more complex, traditional imaging technologies begin to reach their limits—especially when it comes to seeing through silicon or detecting defects beneath the surface. That’s where Quantum Dot-powered Short-Wave Infrared (SWIR) cameras step in, opening up an entirely new window of visibility for semiconductor inspection and process control. Unlike standard SWIR sensors that rely on expensive and often supply-constrained materials like InGaAs, QDot SWIR cameras use colloidal quantum dot technology, offering a cost-effective and scalable solution without compromising on sensitivity. These innovative sensors capture light in the 900–1700 nm range (and beyond), allowing for through-silicon imaging, sub-surface inspection, and contrast enhancement between different materials and layers—all crucial capabilities in today’s semiconductor fabs. QDot SWIR cameras excel in backside wafer inspection, where near-infrared transparency through silicon enables imaging of features otherwise invisible in the visible spectrum. From detecting micro-cracks and delamination to identifying embedded particles and process residues, the system provides high-contrast images even in low-light environments. And thanks to their compatibility with standard CMOS readout electronics, these cameras can be manufactured in compact, high-resolution formats ideal for integration into automated inspection lines. Beyond defect detection, QDot SWIR technology is also invaluable in wafer alignment, metrology, and material sorting. Whether monitoring thermal behavior, spotting lithography misalignments, or evaluating bonding quality in 3D IC packaging, these cameras provide the spectral insight needed to catch issues before they escalate into costly yield losses. With their scalability, affordability, and wavelength flexibility, QDot SWIR cameras represent the next generation of optical inspection in semicon—bridging the gap between visible light imaging and complex, high-cost IR systems. For manufacturers aiming to enhance process visibility while reducing system costs, this technology offers a powerful and future-proof solution.